Two-component, 100%-solids epoxy system for general purpose stress analysis. Transparent, medium viscosity. Cure time as low as six hours at +75°F (+24°C) may be used. Elevated-temperature postcure isrecommended for maximum stability, and/or tests above room temperature.
Highly resistant to moisture and most chemicals, particularly when postcured. For maximum elongation, bonding surface must be roughened. Cryogenic applications require very thin gluelines.